Study of the mechanism of Electrodeposited Film Formation

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  • 電着塗膜形成機構の考察
  • デンチャク トマク ケイセイ キコウ ノ コウサツ

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Abstract

In order to study the mechanism of an electrodeposited film formation, the current through the anode has been measured by an integrating digital voltmeter (5 figures) of which display time is under digital timer's control. The relationships between the current and the deposeited obout of the rapid change at the early period and the slight change at the latter period have been analyzed at higher precision.<BR>1. The plot of the square of the reciprocal of the current density against deposited time, 0-180 sec., has been linear at the constant applied voltage, 10V. The resistance of the electrodeposited matter per 1 coulomb per 1 cm2 (K) was calculated from the slope of this straight line (K=2×105Ω·cow4/coul.).<BR>2. The plot of the logarithm of the current against deposited time, 1-5sec, and the plot of the square of the reciprocal of the current density against the deposited time, 10-480 sec, have been linear at the constant applied voltage, 100V, (K=3.6×106Ω·cm4/coul). The slope of this plot at 50V showed a little alternate variation with the agitation of the liquid in the bath. This Varianl became smaller by the treatment of the anode with zinc phosphate than by notreatment.<BR>The mechanism of the film formation is guessed as follows. The uniform electrodeposited conductive matter changes to the insulator due to the melting process with the joule heat and also due to the dehydration process by the electroosmosis, and as a result of it, the anode is insulated and then the film which adhere on the anode is formed. As far as the conductivity of the film has been kept by the ions in the pin holes which are built up by releasing the bubbles the electrodeposition continues.

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