Effect of mechanical properties of underfill material on the local deformation of a silicon chip mounted on area-arrayed fine bumps

DOI

Bibliographic Information

Other Title
  • エリアアレイバンプ実装チップの局所変形に及ぼすアンダーフィル材質の影響

Abstract

Local deformation of silicon chips mounted on area-arrayed fine metallic bumps has increased drastically in mobile application because of the thinning of the chips. Since such local deformation increases the amplitude of the local residual stress in the chips, the reliability of the chips is degraded seriously. In this study, the effect of the mechanical properties of underfill material on the local deformation was measured by using stress-sensing chips. It was found that the dominant factors of the local deformation changed drastically as a function of the bump pitch.

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Details 詳細情報について

  • CRID
    1390001205556161152
  • NII Article ID
    130005469608
  • DOI
    10.11486/ejisso.24.0_40
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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