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Die bonding technology using sub-micrometer-sized Ag particles
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- Ito Takeshi
- KITC
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- Shinohara Toshiro
- KITC
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- Mitsuhashi Masahiko
- KITC
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- Motoizumi Yu
- KITC
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- Hirai Kiyoshito
- KITC
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- Soga Masayasu
- KITC
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- Akiyama Nobuyuki
- TKK
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- Miyairi Masayuki
- TKK
Bibliographic Information
- Other Title
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- サブミクロン銀粒子を用いたダイボンド技術
Description
We developed and examined the thermal stability of die bonding material (Ag paste) including sub–micrometer–sized Ag particles.We found that Ag paste including Au particles had potential for die bonding with high temperature derability. In addition, the bonding properties were dependent on a metallization layer on a wafer.
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 26 (0), 337-338, 2012
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390001205556472576
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- NII Article ID
- 130005469905
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed
