Technical Challenges for 3D-IC Packaging

DOI

Bibliographic Information

Other Title
  • ３次元集積デバイスの開発課題

Abstract

Although there are a lot of the challenges of 3D-IC development, we are focusing on the die to die interconnection with ultra fine pitch and the underfill material development between die to die. As for the die to die interconnection, IMC bonding that is the small solder volume connection was developed. On the other hand, the the epoxy resin between 3D chips is different from the 2D, and very high thermal conductivity is needed. Therefore, the epoxy resin is coated on Wafer with bumps and then the solder joints and underfill are formed simultaneously.

Journal

Keywords

Details 詳細情報について

  • CRID
    1390001205556494208
  • NII Article ID
    130005469866
  • DOI
    10.11486/ejisso.25.0_49
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

Report a problem

Back to top