Development of Evaluation Method for Geometrical Characterization of Polishing Pad Surface Texture Based on Contact Image Analysis Using Image Rotation Prism

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Bibliographic Information

Other Title
  • ダブプリズムを用いた接触画像解析法に基づくポリシングパッド表面性状の定量評価手法の開発に関する研究
  • Effect of Various Pad Conditions on Proposed Evaluation Parameter Values and Correlation with Polishing Test Results
  • 評価パラメータ値に及ぼす各種パッド諸条件の影響と研磨結果との相関関係

Abstract

In the polishing process, it is pointed out that the removal rate and accuracy as the polishing characteristics are affected by the actual contact conditions between the wafer and the pad. In the previous study, we proposed a new measurement and evaluation method for polishing pad surface texture based on contact image analysis using image rotation prism. We advanced the effective measurement parameters: (1) contact ratio, (2) number of contact points, (3) spacing of contact points, and (4) spatial FFT result of a contact image. In this paper, we demonstrated the measurement characteristics to another polishing pad, and examined the relationship between above proposed parameters and polishing characteristics. As the results, it is found that the characteristics of pad examined in this study denoted the similar tendency of previous examined pad, such as correlation with polishing results.

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Details 詳細情報について

  • CRID
    1390001205652296960
  • NII Article ID
    130005030003
  • DOI
    10.11522/pscjspe.2010a.0.141.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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