Surface Damaged Layer of Single Crystal Copper in Ultra-precision Cutting Process

DOI

Bibliographic Information

Other Title
  • 単結晶銅の超精密切削加工表面における加工変質層

Abstract

To obtain high-qualities on machined surface, not only geometric qualities, such as surfaces roughness and accuracy of dimensions, but also material qualities, such as crystal rotation and residual strain, are necessary to be considered. Single crystal copper subjected to diamond turning in order to study material qualities of surface damaged layer of diamond turned surface. Electron backscatter diffraction analysis was performed on surface damaged layer, and rotation angle of crystals near surface was calculated from the orientation data. Experimental results indicated that friction coefficient of single diamond tool in chips flow direction affected surface roughness and rotation angle of crystals. Crystallographic orientation of cutting direction also affected surface roughness and rotation angle of crystals.

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Details 詳細情報について

  • CRID
    1390001205654313472
  • NII Article ID
    130005030368
  • DOI
    10.11522/pscjspe.2010a.0.799.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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