Effect of Reducing Solvents on Bonding Process through In-situ Formation of Ag Nanoparticles Using Ag2O Microparticles

DOI

Bibliographic Information

Other Title
  • 酸化銀ペーストを用いた銀ナノ粒子その場生成接合プロセスに及ぼす還元溶剤の影響

Description

The bonding strength using Ag2O pastes with various reducing solvents was investigated. The solvent that reduced Ag2O to Ag nanoparticles at the lower temperature provided the higher bonding strength. The formation and sintering behaviors of Ag nanoparticles with various solvents were examined, and the differences on bonding processes were discussed.

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Details 詳細情報について

  • CRID
    1390001205699855360
  • NII Article ID
    130004642167
  • DOI
    10.14920/jwstaikai.2010s.0.47.0
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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