Effect of free-standing Al/Ni multilayer film on thermal resistance of reactively-bonded solder joints

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  • 瞬間はんだ接合部に及ぼすAlNi多層薄膜の自立化の効果

Abstract

<p>To reduce the thermal resistance of solder joints obtained by Al/Ni exothermic reaction, we have fabricated the bonded specimens using the free-standing Al/Ni multilayer film. It is found that the thermal resistance of free-standing AlNi specimen is much lower than that of conventional as-deposited AlNi specimen. It could be considered that free-standing Al/Ni films have an influence on decreasing the number of voids generated at the solder interface, leading to reduction in the resistance of solder joints.</p>

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