Effect of Base Materials on Mechanical Properties of Electroplated Copper Thin Films

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  • SUZUKI Ken
    Tohoku University, Fracture and Reliability Research Institute, Graduate School of Eng.
  • KITAJO Masaki
    Tohoku University, Dept. of Nanomechanics, Graduate School of Engineering
  • MIURA Hideo
    Tohoku University, Fracture and Reliability Research Institute, Graduate School of Eng.

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Other Title
  • 半導体配線用めっき銅薄膜機械特性分布広がりのめっき下地依存性評価

Abstract

<p>Physical properties of electroplated copper thin film used for interconnection materials of devices have a wide distribution in the manufacturing process. In this study, effects of the microtexture of a seed layer on mechanical properties and crystallinity of an electroplated copper thin film were investigated. It was found that quality of the atomic arrangement and crystallographic orientation of the electroplated thin film changed drastically depending on the microtexture of a seed layer. As a result, hardness and Young’s modulus of the electroplated thin film varied from about 1.1 to 2.6 GPa and 115 to 150 GPa, respectively.</p>

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