B211 熱駆動マイクロシザースの開発(OS-6: マイクロ・ナノ熱工学(5))

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  • B211 Development of Thermal Actuated Micro-Scissors

説明

This paper presents the development of thermal actuated micro-scissors. This micro-scissors consists of a single polymeric layer (SU-8), and was fabricated with conventional photolithography techniques. Whole size of micro-scissors device is 4.9mm square, and its blade length is 350 μm, and thickness is 100 μm. The micro-scissors were operated with thermal expansion of their beams resulting from IR laser heating. The experimental results demonstrate that thermal actuated micro-scissors can achieve a displacement for 9.5 〜 24 μm, by changing laser output. The micro-scissors also high repeatability, therefore they can be used for higher level of less-invasive therapies, for instance, single cell resection.

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