A215 高熱伝導筐体でのスマートフォンの放熱挙動(OS-7: 電子機器・デバイスの熱工学的課題と熱流動現象(3))

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  • A215 Cooling Behavior of Smartphone with High Thermal Conductivity Resin Case

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Recently smartphones have thermal problems because heat dissipation of CPU increases with high performance and high density packaging. Hot spots on the rear case are a critical issue for cause of low temperature burn. Cu or graphite sheets which put on the rear case decrease its temperature, but antennas near the rear case are unavailable by the electric conductive sheets. In this paper, cooling behavior of smartphone with high thermal conductivity rear case is studied. It is confirmed that high thermal conductivity resin which does not influence antenna characteristics are effective to cancel hot spots on the rear case.

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