203 半導体ウエハ製造工程における変動ネック工程を考慮した動的WIP管理に関する研究(OS2-1 半導体生産システムのスケジューリング)

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  • 203 Dynamic WIP control management considering change of bottleneck processes in wafer manufacturing

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Processes in wafer manufacturing are re-entrant type, which requires long lead time. The equipment of the production line is high uncertainty, and high-mix low-volume production is increasing in the semiconductor industry. Furthermore, changes in demand are also intense. Traditionally, management approach starting with the bottleneck has been studied to increase productivity. But because the market keeps changing, it is difficult to deat with a fixed bottleneck. In this paper, we propose a method for dynamic WIP control based on the bottleneck index corresponding to the variation. Using throughput and cycle-time as the performance measures, a simulation result shows the effectiveness of the proposed method.

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