Dominant Factors of Electromigration Resistance of Electroplated copper Thin-film Interconnections
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- KATO Takeru
- Department of Finemechanics, Graduate School of Engineering, Tohoku University
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- Suzuki Ken
- Tohoku University
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- Miura Hideo
- Tohoku University
Bibliographic Information
- Other Title
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- めっき銅薄膜配線のエレクトロマイグレーション耐性支配因子の解明
Journal
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- The Proceedings of Conference of Tohoku Branch
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The Proceedings of Conference of Tohoku Branch 2017.52 (0), 146-, 2017
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390001205942125824
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- NII Article ID
- 130006731664
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- ISSN
- 24242713
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles