Improvement method of the crystallinity of electroplated copper thin films for next-generation interconnections of electronic devices
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- LIU Jiatong
- 東北大院
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- SUZUKI Ken
- 東北大
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- MIURA Hideo
- 東北大
Bibliographic Information
- Other Title
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- 次世代半導体デバイス用めっき銅配線薄膜の結晶性向上手法の確立
Journal
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- The Proceedings of Conference of Tohoku Branch
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The Proceedings of Conference of Tohoku Branch 2017.52 (0), 147-, 2017
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390001205942126848
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- NII Article ID
- 130006731665
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- ISSN
- 24242713
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles