S0304-1-2 EBSD法を利用した電着銅薄膜による主応力測定法([S0304-1]応力・ひずみ測定)

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  • S0304-1-2 Principal Stress Measurement Using EBSD Analysis of Electrodeposited Copper Foil

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A cyclic biaxial stress measurement method using electrodeposited copper foil was examined. The crystallographic orientations of individual grains that undergo grain growth in copper foil subjected to cyclic loading were analyzed by electron backscatter diffraction (EBSD). Most grown grains were oriented with the {110} plane parallel to the foil surface, and the grown grain slip direction corresponded closely to the maximum shearing stress direction. The angle between the longitudinal direction and the straight line connecting two circumferential high-density areas in the {110} pole figure corresponded to the shearing stress direction. Moreover, the number of grains with slip directions that did not correspond to the direction of maximum shearing stress increased as the biaxial stress ratio approached zero. On the basis of these features, we propose biaxial stress measurement using EBSD.

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