書誌事項
- タイトル別名
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- 2125 Experimental Study on Mechanical Properties of Sn-3.0Ag-0.5Cu
説明
Research and development of lead-free solder has been advanced from point of view of environment issue and control. However, there is few research which is formulated the constitutive equation. The purpose of this study is to investigate the mechanical properties of Sn-3.0Ag-0.5Cu in order to formulate the constitutive equation. It was conducted tensile test, compressive test, torsional test and proportional loading test under several strain rates (6.0×10^<-3>, 6.0×10^<-4>, 6.0×10^<-5>l/s) and temperatures (288K, 223K). The obtained results are presented and discussed in this paper.
収録刊行物
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- 年次大会講演論文集
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年次大会講演論文集 2007.1 (0), 187-188, 2007
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001206065331200
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- NII論文ID
- 110007086204
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- ISSN
- 24331325
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可