Effect of the Size of Micro-Pin-Fin on Boiling Heat Transfer from Silicon Chips Immersed in FC-72.

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  • マイクロピンフィンを有するシリコンチップ上のＦＣ‐７２の沸騰熱伝達におよぼすフィン寸法の影響
  • マイクロピンフィン オ ユウスル シリコンチップ ジョウ ノ FC 72 ノ フットウ ネツ デンタツ ニ オヨボス フィン スンポウ ノ エイキョウ

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Abstract

Experiments were conducted to study the effect of the size of micro-pin-fin on the boiling heat transfer from a silicon chip immersed in a pool of degassed or gas-dissolved FC-72. Four kinds of micro-pin-fins with the dimensions of 10 × 10 × 60 to 50 × 50 × 60 μm3 (width × thickness × height) were fabricated on the surface of a square silicon chip with the dimensions of 10 × 10 × 0.5 mm3 by use of the dry etching technique. Experiments were conducted at the liquid subcoolings Δ Tsub of 0, 3, 25 and 45 K under the atmospheric condition. The results were compared with those for a smooth chip and previously developed enhanced surfaces. The micro-pin-finned chips showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The boiling curve showed a steep increase in the heat flux with increasing wall superheat. For the micro-pin-finned chips, the critical heat flux was 1.9 to 2.3 times as large as that for the smooth chip and the wall temperature at the critical-heat-flux point was less than the upper limit for the reliable operation of LSI chips (=85°C). While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.

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