IrO<sub>2</sub>/Pb(Zr<sub>x</sub>Ti<sub>1-x</sub>)O<sub>3</sub>(PZT)/Pt Ferroelectric Thin-Film Capacitors Resistant to an Interlayer-Dielectric-Deposition Process

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  • IrO2/Pb(ZrxTi1-x)03(PZT)/Pt Ferroelectric Thin-Film Capacitors Resistant to an Interlayer-Dielectric-Deposition Process.

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Resistance of the IrO2/PZT/Pt ferroelectric capacitor to the ambient of an interlayer-dielectric-deposition process is investigated for integrating the capacitor in a ferroelectric nonvolatile memory. Silicon dioxide films are deposited on the capacitor as the interlayer dielectric by plasma-enhanced chemical vapor deposition (CVD) using SiH4 and N2O gases. Degradation of ferroelectric characteristics reported so far for Pt/PZT/Pt capacitors is found to be significantly suppressed in the IrO2/PZT/Pt structure. This is because IrO2 does not show a catalytic effect as exhibited by a platinum electrode which causes hydrogen decomposition during the CVD processes. Hence, the IrO2/PZT/Pt capacitor structure proposed by us did not undergo the degradation in the process.

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