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- 古谷 修一
- 古河電気工業株式会社 現在古河アルミニウム工業株式会社技術研究所
書誌事項
- タイトル別名
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- Growth Mechanism of Copper Surface Tarnishing Film in the Vicinity of Ambient Temperature and Simple Surface Film Analizers
- シツオン フキン デ ノ ドウ ノ ヒョウメン ヘンショク ヒマク ノ セイチ
この論文をさがす
抄録
Copper is widely used to make cables, printed circuit boards and various structural components. However, copper tends to form thin film of oxide or sulfide on its surface, presenting tarnished appearance or undesired effects such as lowering of electrical characteristics. The present study elucidates the growth mechanism of such film through analysis of the influence of temperature, humidity, contaminating substance, surface treatment and impurity gases (SO2, HCl, H2S) on the growth speed of the film. It was found out that the long-established cathodic reduction technique was the simplest and yet considerably accurate analyzing method.
収録刊行物
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- CORROSION ENGINEERING
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CORROSION ENGINEERING 38 (9), 485-492, 1989
社団法人 腐食防食協会
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詳細情報 詳細情報について
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- CRID
- 1390001206258840704
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- NII論文ID
- 130004732125
- 130006025359
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- NII書誌ID
- AN00225595
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- ISSN
- 18841155
- 00109355
- http://id.crossref.org/issn/00109355
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- NDL書誌ID
- 3247705
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可