Growth Mechanism of Copper Surface Tarnishing Film in the Vicinity of Ambient Temperature and Simple Surface Film Analizers

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  • Furuya Shuichi
    Furukawa Electric Co., Ltd Present: Technical Research Laboratories, Furukawa Aluminum Co., Ltd.

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  • 室温付近での銅の表面変色皮膜の成長機構と簡易分析装置
  • シツオン フキン デ ノ ドウ ノ ヒョウメン ヘンショク ヒマク ノ セイチ

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Abstract

Copper is widely used to make cables, printed circuit boards and various structural components. However, copper tends to form thin film of oxide or sulfide on its surface, presenting tarnished appearance or undesired effects such as lowering of electrical characteristics. The present study elucidates the growth mechanism of such film through analysis of the influence of temperature, humidity, contaminating substance, surface treatment and impurity gases (SO2, HCl, H2S) on the growth speed of the film. It was found out that the long-established cathodic reduction technique was the simplest and yet considerably accurate analyzing method.

Journal

  • CORROSION ENGINEERING

    CORROSION ENGINEERING 38 (9), 485-492, 1989

    Japan Society of Corrosion Engineering

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