放電プラズマ焼結法によるシリコン研削スラッジの高純度化

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  • Purification of Silicon Grinding Sludge by Spark Plasma Sintering
  • ホウデン プラズマ ショウケツホウ ニ ヨル シリコン ケンサク スラッジ ノ コウジュンドカ

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Recycling possibilities of silicon grinding sludge using spark plasma sintering (SPS) method were investigated. The silicon grinding sludge taken out from wastewater in silicon wafer production process was sintered by the SPS method. Sintering experiment results showed that production of sintered compacts was possible from the silicon sludge by SPS. Density and hardness of sintered compacts were increased with both sintering temperature and holding time. Results of composition analyses indicated that the sintering increased silicon purity of the compacts due to decreasing oxygen content. The content of silicon in the sintered compact was increased up to about 20 mass% compared with that in the silicon sludge. XRD analysis suggested also decreasing oxygen content by the sintering. Therefore, it was revealed that higher-purity silicon sintered compacts were produced by sintering of the silicon sludge with the SPS method in our study.

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