低融点Ａｇ系ろう材の各種工業用金属板に対するぬれ性，界面反応ならびに接合強度

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  • Wettability, Interfacial Reaction and Joint Strength between Low Melting Ag Based Brazing Alloy and Some Industrial Metal Plates
  • テイユウテン Agケイロウ ザイ ノ カクシュ コウギョウ ヨウキンゾクバン ニ タイスル ヌレセイ カイメン ハンノウ ナラビニ セツゴウ キョウド

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We have developed the Ag-Cu-Sn-Ni quaternary brazing filler metal having a low melting point, a high strength and a high ductility. Then, we produced wire saws composed of Ni-coated SUS304 wires, on which diamond abrasives are fixed with this brazing filler metal. We tried to slice the Si ingots using this wire saw. Good results were obtained for the application to the production of silicon wafers for solar cells. Accordingly, we focused on the basic experiments for further performance of the fixed abrasive diamond wire saws, leading to low cost of slicing technique of hard materials such as silicon and sapphire. In particular, we examined wettability, interfacial reaction and joint strength between Ag-Cu-Sn-Ni quaternary brazing filler metal and industrial metal plates such as Cu, Ni or flux coated SUS304.

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