Fatigue Life of Lead Free Solder BGA Joints Against Vibration Stress under High Temperature Circumstance
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- MATSUSHIMA Michiya
- Graduate School of Engineering, Osaka University
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- FURUSAWA Takeshi
- Graduate School of Engineering, Osaka University
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- FUKUDA Kyohei
- Graduate School of Engineering, Osaka University
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- EGUSA Minoru
- Graduate School of Engineering, Osaka University
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- YASUDA Kiyokazu
- Graduate School of Engineering, Osaka University
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- FUJIMOTO Kozo
- Graduate School of Engineering, Osaka University
Bibliographic Information
- Other Title
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- 高温環境下における鉛フリーはんだBGA 接合部の振動疲労寿命
- コウオン カンキョウ カ ニ オケル ナマリ フリー ハンダ BGA セツゴウブ ノ シンドウ ヒロウ ジュミョウ
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Abstract
Recently, the wave of car computerizing is surging such as electronic control unit, car navigation system, electronic toll collection system, car to car communication system, etc. The use environment of in-car devices is under combined environmental stresses such as thermal stress, vibration, and humidity. In general, the reliability of the joints of the devices is individually tested by the evaluation methods for each stress. Our main purpose of this study is to construct the evaluation method for the damages of solder joints under multiple environmental stresses. We investigated the relationship between the plastic strain caused by one cycle vibration stress calculated with FEM analysis considering the temperature dependency of the elasto-plasticity and the fatigue life obtained by the vibration experiment. We indicated the adequacy of the analysis by the correspondence of the resonance frequency of the BGA package mounting board with the experimental result. We also showed that the plastic strain concentrating position corresponded to the crack position. We clarified that the creep strain rate in the total strain was less than 1 percent. We demonstrated that we could apply the power-law equation to predict the fatigue life of the vibration stress from plastic strain rate under 80°C and 125°C as well as the room temperature.
Journal
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- Journal of High Temperature Society
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Journal of High Temperature Society 32 (4), 219-225, 2006
High Temperature Society of Japan
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Details 詳細情報について
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- CRID
- 1390001206430844160
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- NII Article ID
- 10029254196
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- NII Book ID
- AN00080051
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- COI
- 1:CAS:528:DC%2BD28XhtV2rsbfI
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- NDL BIB ID
- 8052908
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- ISSN
- 03871096
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed