書誌事項
- タイトル別名
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- Inhibition of Whisker Growth from Zinc Electroplate
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説明
Spontaneous growth of whiskers from electroplated zinc is known to occur at room temperature. Since whiskers may occasionally cause short-circuiting, prevention of the whisker growth is a technologically important problem in the electronics industry. Recently, a new problem that zinc whiskers from zinc plated props at raised access floor are transported into a computer through the cooling fan and cause shut down of the computer, is occurred. High concentrations of cyanide in zinc baths contribute to the role of the brightener and lead to declined internal stress levels in the plating, which significantly affects the inhibition of whisker growth.
収録刊行物
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- 表面科学
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表面科学 26 (3), 165-170, 2005
公益社団法人 日本表面科学会
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詳細情報 詳細情報について
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- CRID
- 1390001206458393984
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- NII論文ID
- 130004486252
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- COI
- 1:CAS:528:DC%2BD2MXksFOgsLc%3D
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- ISSN
- 18814743
- 03885321
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可
