Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

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  • アンダーフィル封止ＣＳＰ鉛フリーはんだ接合部の熱疲労寿命評価

Abstract

  The effect of filler content in an underfill material on thermal fatigue life of a lead-free solder joint of a chip size package (CSP) has been investigated. Three types of bisphenol-F-type epoxy-based underfill material, which filler content was changed from 0 to 60 mass%, were prepared. The thermal cycle test in a temperature range from -40 to 125°C was conducted to investigate thermal fatigue lives of solder joints encapsulated with underfill materials. Plastic strain range loaded in the solder joint under thermal cycle conditions was investigated by a finite element analysis method. From the thermal cycle test results, it was clarified that the thermal fatigue life of the solder joint increases with increasing filler content in the underfill material investigated. Moreover, a Coffin-Manson-type of relation was obtained between the plastic strain range and the thermal fatigue life. n value in the Coffin-Manson's equation was estimated to be 1.8.<br>

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