書誌事項
- タイトル別名
-
- Whisker-Free Pb-Free Solder through Alloying
- 合金としてのウィスカ抑制Pbフリーはんだ
- ゴウキン ト シテ ノ ウィスカ ヨクセイ Pb フリー ハンダ
この論文をさがす
抄録
Electronic products with Sn-Pb solder are being now excluded due to the harmful effect of Pb on the environment. Generally, Sn-Ag-Cu solder is used in place of Sn-Pb solder. In the solder joint, acicular crystals called whiskers often grow. Whiskers often cause a short-circuit problem in a fine-pitch solder joint. In this study, several lead-free solders added with a small amount of various elements were prepared to investigate the effectiveness validity of added elements in restraining whisker growth. The elements effective in inhibiting whisker growth were identified.<br>
収録刊行物
-
- 日本金属学会誌
-
日本金属学会誌 70 (3), 220-225, 2006
公益社団法人 日本金属学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390001206480204032
-
- NII論文ID
- 10017967197
-
- NII書誌ID
- AN00187860
-
- ISSN
- 18806880
- 24337501
- 00214876
-
- NDL書誌ID
- 7903346
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可