On the Dissolution of Solid Nickel, Copper and Silver in Liquid Bismuth at Elevated Temperature

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  • Miyake Masanobu
    Department of Nuclear Engineering, Faculty of Engineering, Osaka University
  • Sano Tadao
    Department of Nuclear Engineering, Faculty of Engineering, Osaka University

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  • 高温におけるNi, Cu, Agの液体Biへの溶解現象
  • コウオン ニ オケル Ni , Cu , Ag ノ エキタイ Bi エ ノ ヨウカイ ゲンショウ

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Abstract

As one of the basic research on the mechanism of reaction between solid and liquid metals, a kinetic study has been made on the dissolution processes of pure solid metals, Ni, Cu and Ag into liquid pure Bi. The experiments were carried out under the static and isothermal condition over a range of temperatures from 500° to 900°C in argon atmosphere, and the rate of dissolution was followed by analyzing a small sample drawn successively from the liquid solution after a predetermined time of dissolution. The obtained rates of dissolution have been found to obey unimolecular reaction law expressed in a form of n=ns{1−exp(k·S⁄V·t)}, as in the case of dissolution for these systems obtained previously in the lower range of temperatures from 300° to 500°C. The rapid rise in solution rate constants of Ni, Cu and Ag which was attributed to the change in the behavior of dissolution was observed at temperatures above 500°, 600° and 450°C, respectively. On the other hand, a remarkable change in the temperature dependence upon the experimental solubilities for Ni, Cu and Ag in liquid Bi was observed at the same temperature levels. Taking account of the correspondence of the change in solution rate constants with that of solubility, it is inferred that the rate of dissolution is determined by the diffusion process of solute atom in the effective boundary layer near the solid surface, in which the values of concentration of the dissolved metal are almost the same as that of saturation concentration.

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