Ni, CuのCu-Bi, Ni-Bi溶液への溶解現象

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タイトル別名
  • On the Dissolution of Solid Nickel and Copper in Liquid Copper-Bismuth and Nickel Bismuth Solutions
  • Ni , Cu ノ Cu-Bi , Ni-Bi ヨウエキ エ ノ ヨウカイ ゲンショウ

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A Kinetic study has been made on the dissolution of solid Ni in liquid Cu-Bi and Cu in Ni-Bi solutions of various concentrations. The experiments were carried out under the static and isothermal conditions in the temperature range of 450°∼550°C and the dissolution process was followed by analyzing small samples drawn successively from the liquid solution during the course of a run. It was found that the dissolution process for these systems followed the same expression of the form of n=ns{1−exp(−k·S⁄V·t)} as that which was applied to the dissolution process of these solid metals in pure liquid Bi, and that the obtained values of solution rate constant decreased linearly with the increasing Cu or Ni concentration in solutions. On the other hand, it was shown that the solubilities of Ni in Cu-Bi solutions decreased with the increasing Cu concentration in solution, while those of Cu in Ni-Bi solutions increased with the increase in Ni concentration. Assuming a stronger mutual interaction between Ni and Cu atoms coexisting in solution, an explanation for the dissolution mechanism of these systems are proposed.

収録刊行物

  • 日本金属学会誌

    日本金属学会誌 28 (3), 116-121, 1964

    公益社団法人 日本金属学会

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