タフピッチ銅線中の酸素含有量とカッピング発生との関係

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タイトル別名
  • Relation between Oxygen Contents and the Cupping of Tough Pitch Copper Wire
  • タフ ピッチ ドウセンチュウ ノ サンソ ガンユウリョウ ト カッピング ハッ

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説明

The influence of oxygen contents in copper wire on the occurrence of cupping has been studied. The defect occurred more often with increasing oxygen content, especially, when it was >400 ppm and no cupping was observed when it was as low as 4 ppm. From microscopic observations, it has been concluded that the amount of Cu2O which causes the wire to break easily induces void formation under tensile force and acts as the cause to accelerate the defect. The stress distributions in the deforming zones found both by FEM and slip line solution were also shown as they are the controlling factors for cupping.

収録刊行物

  • 日本金属学会誌

    日本金属学会誌 43 (7), 618-625, 1979

    公益社団法人 日本金属学会

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