Microstructure of Ni Film Electroplated from a Watts Bath

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  • Watanabe Tohru
    Department of Industrial Chemistry, Faculty of Technology, Tokyo Metroporitan University
  • Kanayama Takanori
    Metallurgical Engineering, Shibaura Institute of Technology

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  • ワット浴より電析されたNi膜の微細構造
  • ワットヨク ヨリ デンセキサレタ Ni マク ノ ビサイ コウゾウ

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Abstract

The cross-sectional microstructure of the Ni film electroplated from a Watts type bath was observed by transmission electron microscopy in detail and the formation process of a layered structure which had been observed sometimes in the cross-section of the film was discussed. It was found that the layered structure is the alternate structure of large crystal layers and small crystal layers. The reason for the formation of the layered structure is related to the bubbles of hydrogen evoluted at higher current density plating. Namely, when the evoluted hydrogen bubbles rise along the cathode surface, a diffusion layer on the cathode surface is agitated by the bubbles, and then the Ni atoms are deposited and plating is carried out without existence of a diffusion layer. At this time, the large crystal layer is formed. But, after a short time, the diffusion layer is formed again and the deposition of atoms takes place through the diffusion layer. At this time the small crystal layer is formed. The formation of the layered structure observed in the cross-section of the Ni plating film results from alternate occurrence of this behavior in accordance with the chemical reaction change on the Ni plating.<BR>The crystallographic relationship between the deposited Ni film and the Cu substrate is also discussed.

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