Composition Changes of Ni-Sn Film During Electroplating and Uniformity by Addition of Glycine

Watanabe Tohru, Arai Kazuyoshi, Hirose Takeshi

doi:10.2320/jinstmet1952.64.4_242

It has been widely accepted that the structure of plated films differ, depending on the kind of plating solution and the plating conditions. However, the authors believe that the structure of plated films is independent of both the kind of plating solution and the plating conditions, and mainly depends on the composition of plated films. Namely, we are of the opinion that the plated film is a completely metallic material. The reason that the above theory has been believed so far can be attributed to the lack of knowledge on the structure change caused by the change of solution in the vicinity of the cathode surface during plating. In this investigation, the relationship between the conditions of the plating solution near the cathode surface and the structure of the electroplated alloy film are discussed in detail. The structure of the electrodeposited Ni-Sn alloy films was analyzed using the X-ray diffraction method and the cross sectional structure of the plated film was observed by transmission electron microscopy. It was found that the chemical reaction on the cathode surface changed due to the pH rise during plating, which caused the compositional change in the plated film resulting in the change in its structure. As a result, the plated film had a layered structure in the thickness direction. However, the addition of glycine to the bath was effective for electrodepositing a homogeneous film free from a layered structure.

Composition Changes of Ni-Sn Film During Electroplating and Uniformity by Addition of Glycine

Bibliographic Information

Search this article

Description

Journal

Citations (2)*help

References(15)*help

Keywords

Details 詳細情報について

Export

Report a problem