Electrodeposition of Ni-Cu Alloys in an Air and Water Stable Room Temperature Ionic Liquid

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  • DENG Ming-Jay
    Department of Chemistry, National Cheng Kung University
  • LIN Pei-Chiung
    Department of Chemistry, National Cheng Kung University
  • SUN I-Wen
    Department of Chemistry, National Cheng Kung University
  • CHEN Po-Yu
    Faculty of Medicinal and Applied Chemistry, Kaohsiung Medical University
  • CHANG Jeng-Kuei
    Department of Materials Science and Engineering, National Cheng Kung University

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Description

Due to the ligand property of the DCA anion, both CuCl and NiCl2 are soluble in 1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA) ionic liquid. Cyclic voltammograms of Ni(II), Cu(I), and Ni(II)+Cu(I), respectively, in EMI-DCA were recorded on the glassy carbon electrode at 30°C. It is interesting to note that the thermodynamic deposition potentials of Ni and Cu are very close to each other. This is especially favorable for the electrodeposition of Ni-Cu alloys without any additive. The Ni-Cu alloys were electrodeposited using bulk controlled-potential electrolysis experiments. Energy-dispersive spectroscopy (EDS) data indicates that the composition of the Ni-Cu alloys not only depends on the deposition potential, but also on the Cu(I) and Ni(II) concentrations in the melt.

Journal

  • Electrochemistry

    Electrochemistry 77 (8), 582-584, 2009

    The Electrochemical Society of Japan

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