EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires

DOI Web Site Web Site 参考文献19件
  • KE Yiqing
    Graduate School of Science and Engineering, Ibaraki University
  • NAMEKAWA Takashi
    Department of Materials Science and Engineering, Ibaraki University
  • TAMAHASHI Kunihiro
    Department of Materials Science and Engineering, Ibaraki University
  • INAMI Takashi
    Department of Materials Science and Engineering, Ibaraki University
  • ONUKI Jin
    Department of Materials Science and Engineering, Ibaraki University

この論文をさがす

抄録

A microstructure analysis along the trench depth direction of Cu wires as a function of the purity of plating materials was carried out using electron backscattering diffraction (EBSD) analysis combined with advanced CMP technique. The Cu wire plated with high purity plating materials (6N-electrolyte and 8N-anode) was found to have 13% larger grains and 50% lower ratio of small grains (less than 45 nm) than those for the Cu wire plated with conventional purity plating materials (3N-electrolyte and 3N-anode) at the bottom region of the trench after annealing. A grain growth model in the trench depth direction was also investigated.

収録刊行物

  • Electrochemistry

    Electrochemistry 81 (4), 246-250, 2013

    公益社団法人　電気化学会

参考文献 (19)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ