EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires
-
- KE Yiqing
- Graduate School of Science and Engineering, Ibaraki University
-
- NAMEKAWA Takashi
- Department of Materials Science and Engineering, Ibaraki University
-
- TAMAHASHI Kunihiro
- Department of Materials Science and Engineering, Ibaraki University
-
- INAMI Takashi
- Department of Materials Science and Engineering, Ibaraki University
-
- ONUKI Jin
- Department of Materials Science and Engineering, Ibaraki University
この論文をさがす
説明
A microstructure analysis along the trench depth direction of Cu wires as a function of the purity of plating materials was carried out using electron backscattering diffraction (EBSD) analysis combined with advanced CMP technique. The Cu wire plated with high purity plating materials (6N-electrolyte and 8N-anode) was found to have 13% larger grains and 50% lower ratio of small grains (less than 45 nm) than those for the Cu wire plated with conventional purity plating materials (3N-electrolyte and 3N-anode) at the bottom region of the trench after annealing. A grain growth model in the trench depth direction was also investigated.
収録刊行物
-
- Electrochemistry
-
Electrochemistry 81 (4), 246-250, 2013
公益社団法人 電気化学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390001206497586944
-
- NII論文ID
- 10031139478
-
- NII書誌ID
- AN00151637
-
- ISSN
- 21862451
- 13443542
-
- NDL書誌ID
- 024383611
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用可