Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode
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- KANZAKI Yasushi
- Department of Applied Chemistry, Kanagawa Institute of Technology
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- BRUCKENSTEIN Stanley
- Department of Chemistry, State University of New York at Buffalo
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The anodic dissolution of copper was examined in oxygenated sulfuric acid solution. A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state. On the other hand, H2O2 was formed during anodic dissolution in oxygenated solution by the reaction of Cu+ with O2. The intermediate Cu+ and the byproduct H2O2 were detected in this study using a rotating ring-disk electrode. The anodic dissolution process including the role of oxygen was elucidated through the detection of Cu+ and H2O2. The decrease in the activity of Cu+ in the presence of O2 involved a negative shift of the partial current of Cu → Cu2+ (or Cu+), and resulted in a negative shift of the corrosion potential with increasing stirring rate of the solution. In addition, Cu+ was found to be not a transient intermediate, but rather, a thermodynamic equilibrium species. The acceleration of the corrosion rate in the presence of O2 was elucidated successfully to be due to the couple of the partial currents for Cu → Cu+ and O2 → H2O2.
収録刊行物
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- Electrochemistry
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Electrochemistry 81 (7), 547-552, 2013
公益社団法人 電気化学会
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詳細情報 詳細情報について
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- CRID
- 1390001206499150976
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- NII論文ID
- 10031178967
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- NII書誌ID
- AN00151637
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- ISSN
- 21862451
- 13443542
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- NDL書誌ID
- 024669226
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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