Properties of Mold Materials Bonded with Aluminum Phosphate and Phosphoric Acid

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  • りん酸アルミニウムとりん酸を粘結材とする鋳型材の性質
  • リン酸アルミニウムとりん酸を粘結材とする鋳型材の性質
  • リンサン アルミニウム ト リンサン オ ネンケツザイ ト スル イガタザイ

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Abstract

  Silicious molds using aluminum phosphate (AlPO4) and phosphoric acid (H3PO4) as a binder are heat resistant and acid-decomposeable. The silica sand mold resists up to 1,200°C when the molecular ratio of the binder Al2O3/P2O5 is 0.636, and up to 800°C when Al2O3/P2O5 is 0.304. The zircon sand mold resists up to 1,400°C when Al2O3/P2O5 is 0.636. The binder separates Al2O3⋅mH3⋅PO4nH2O which subsequently loses water during drying, produces a viscous solution and forms a mixture of Al(PO3)3 and AlPO4 at 800°C. When the Al2O3/P2O5 ratio of the binder is higher, silica sand particles bind with acid-soluble AlPO4 preventing sintering of the particles during casting. This mold decomposes readily by dipping into a dilute sulphuric acid solution.

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