Flow characteristics of epoxy resin systems for low pressure transfer molding.

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  • SAEKI Junichi
    Production Engineering Research Laboratory, Hitachi, Ltd.
  • KANEDA Aizo
    Production Engineering Research Laboratory, Hitachi, Ltd.
  • SHINODA Tadao
    Production Engineering Research Laboratory, Hitachi, Ltd.

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Other Title
  • 低圧トランスファー成形用エポキシ樹脂の流動特性
  • テイアツ トランスファー セイケイヨウ エポキシ ジュシ ノ リュウドウ トク

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Description

Flow characteristics of silica filled trial epoxy resin systems having neither a curing agent nor a catalystwere examined in the absence of any chemical reaction that would cause a viscosity rise. A plunger extrusiontype of capillary rheometer was used in this study. Both molten materials, which had the same resin com-position except filler content, showed a power law fluid behaviour of slightly shear thinning over the observedranges of temperature and shear rate. The values of power law index ranged from around 0.83 to 0.95. Viscosity was found to be dominated by temperature rather than by shear rate under the present experi-mental conditions. A temperature difference of 40 degrees brought about a decade of viscosity change. The relationship between temperature and viscosity of each material was described by an Andrade's equation.

Journal

  • KOBUNSHI RONBUNSHU

    KOBUNSHI RONBUNSHU 43 (12), 873-879, 1986

    The Society of Polymer Science, Japan

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