書誌事項
- タイトル別名
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- Material Design and Evaluation Technology of Backgrind Tape
- バックグラインドテープ ノ ザイリョウ セッケイ ト ヒョウカ ギジュツ
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Backgrind tape (BG tape) is widely used in semiconductor process to protect wafer surface as well as to prevent wafer crack. Among those tapes employed in industries, BG tape can be characterized by high precision in thickness and clean design by controlling both foreign and residual contaminations. BG tape is composed of base film and adhesive covered by release film. For base film, EVA, PET or other layered materials have been used. Some special materials were also reported for well contacting bumpy wafer surface. Adhesive is designed with acrylate in general, and material design should be cared to reduce residue. UV-curable adhesive is also used. In the technology that wafer thickness becomes thinner, BG tape will compete with other materials. Design of BG tape should be further investigated for handling ultra-thin wafer with facility.
収録刊行物
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- 日本ゴム協会誌
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日本ゴム協会誌 85 (2), 46-51, 2012
一般社団法人 日本ゴム協会
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詳細情報 詳細情報について
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- CRID
- 1390001206562024832
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- NII論文ID
- 10030144058
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- NII書誌ID
- AN00269207
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- COI
- 1:CAS:528:DC%2BC38XotVOhur0%3D
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- ISSN
- 18840442
- 0029022X
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- NDL書誌ID
- 023420695
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可