Development of a Strain Sensor for Measuring the Strain Distribution in the 3D Electronic Packages

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  • MIZUNO Ryota
    Dept. of Finemechanics, Grad. School of Eng., Tohoku Univ.
  • SUZUKI Ken
    Fracture and Reliability Research Institute, Tohoku University
  • MIURA Hideo
    Fracture and Reliability Research Institute, Tohoku University

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  • 3 次元実装構造内部ひずみ分布評価用センサの開発

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