Development of a Strain Sensor for Measuring the Strain Distribution in the 3D Electronic Packages
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- MIZUNO Ryota
- Dept. of Finemechanics, Grad. School of Eng., Tohoku Univ.
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- SUZUKI Ken
- Fracture and Reliability Research Institute, Tohoku University
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- MIURA Hideo
- Fracture and Reliability Research Institute, Tohoku University
Bibliographic Information
- Other Title
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- 3 次元実装構造内部ひずみ分布評価用センサの開発
Journal
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- The Proceedings of Conference of Tohoku Branch
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The Proceedings of Conference of Tohoku Branch 2019.54 (0), 135-, 2019
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390001277354686976
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- NII Article ID
- 130007713647
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- ISSN
- 24242713
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles