電界誘起マイクロバブルを用いた直接凝着めっき法の創生

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  • Development of direct metallization using electrically induced micro-bubbles

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In this study, we propose a new metallization method which is based on the cavitation phenomena and electro-chemical properties of micro-bubbles. First of all, one point metallization experiment was carried out and it was confirmed that the metal is successfully fixed on a substrate. As a result, we confirmed that deposited material was seems to be nickel. Nickel which is initially ionic state in plating solution can be deposited by reduction reaction which is brought by electric charge on the bubble. This technology has possibility to metallize wide range of materials such as paper, polymer, metal and so on, and easy to apply to the 3D printing machine. Precise, robust and simple electrical circuit can be fabricated without any complicated procedures and pre-treatment and which can be contribute to micro-fabrication technology.

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