CoPtCrSiターゲットの酸素リアクティブスパッタリングによるCoPtCr–SiO<sub>2</sub>グラニュラー薄膜の低ガス圧成膜

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タイトル別名
  • Low–pressure Deposition of CoPtCr–SiO<sub>2</sub> Granular Films by Ar+O<sub>2</sub> Reactive Sputtering Using CoPtCrSi Target
  • CoPtCrSiターゲットの酸素リアクティブスパッタリングによるCoPtCr–SiO₂グラニュラー薄膜の低ガス圧成膜
  • CoPtCrSi ターゲット ノ サンソ リアクティブスパッタリング ニ ヨル CoPtCr – SiO ₂ グラニュラー ハクマク ノ テイガスアツセイマク

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抄録

<p>To improve the surface flatness, impact and corrosion resistance of magnetic recording media, low–pressure (0.6 Pa) deposition of CoPtCr–SiO2 granular films by Ar+O2 reactive sputtering using a Co65Pt14Cr9Si12 target was investigated. It was found that as the fraction of oxygen in the sputtering gas flow (FO2) was increased from 0 to 20%, the deposition rate increased from 2.8 to 4.3 nm/s, and then decreased to 1.1 nm/s as FO2 was further increased. For FO2=10–12%, the designed composition with the desired oxygen content (Co74Pt16Cr10–8 mol%SiO2) could be achieved. For FO2=8%, while a flat surface granular film with c-plane oriented CoPtCr grains was realized, a slight amount of Si remaining in magnetic grains which indicated the insufficient segregation of SiO2 into the grain boundaries was observed.</p>

収録刊行物

  • 表面と真空

    表面と真空 61 (7), 469-473, 2018-07-10

    公益社団法人 日本表面真空学会

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