Novel Wiring Structure for 3D Conformable Devices
Bibliographic Information
- Other Title
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- 3次元形状にフィットする新しい配線構造
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 30 (0), 418-421, 2016
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390001288085673088
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- Text Lang
- ja
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- Data Source
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- JaLC