Sn-Ag-Cu-Ni 系はんだによる噴流はんだ付けにおける微小量の固相がはんだ付け性に及ぼす影響

重田 晃二, 岩田 典也, 出田 吾朗, 宮本 照雄

doi:10.7791/jspmee.5.244

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Influence of Small Amount of Solid Phase on Solderability in Wave Soldering Process by using of Sn-Ag-Cu-Ni Based Solder
Sn-Ag-Cu-Niケイハンダニヨルフンリュウハンダズケニオケルビショウリョウノコソウガハンダズケセイニオヨボスエイキョウ

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Cu dissolution of electrodes on printed circuit boards (PCB) and Fe erosion of solder baths have been still the problems in wave soldering by Sn-Ag-Cu lead-free solder, because Sn-Ag-Cu alloy is highly reactive to metals compared with Sn-Pb eutectic alloy. The countermeasure to control dissolution rate of Cu is not only increasing Cu concentration, but also increasing Ni concentration in the molten lead-free solder. Although Ni addition is certainly effective to inhibit Cu dissolution in Sn-Ag-Cu solder, liquidus temperature of the solder rises according to Ni concentration. Therefore, it is concerned that solidification of Cu-Ni-Sn intermetallic compound (IMC) phase may occur in molten solder maintained at soldering temperature. In this study, the influence of Ni concentration of Sn-3.0Ag-0.5Cu-xNi alloy on solderability in wave soldering process is investigated by the observation of separating solder joint on PCB from the surface of molten solder with the high-speed VTR. As a result, it is clarified that the partial solidification slightly influences on fluidity of molten solder, but the wave soldering by Sn-3.0Ag-0.5Cu-xNi alloy will be practical even around the liquidus temperature.

収録刊行物

Journal of Smart Processing

Journal of Smart Processing 5 (4), 244-250, 2016

一般社団法人スマートプロセス学会（旧高温学会）

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