Effects of Solid Dielectric Material and Compressive Force on Interfacial AC Breakdown Voltage between Two Solid Dielectrics

Osawa Naoki, Masui Hidetaka, Aoshima Moriyuki, Imai Ryuta, Moribayashi Takumi, Yoshioka Yoshio, Yanase Hironori, Okamoto Kenji

doi:10.1541/ieejfms.139.147

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Other Title

固体絶縁物接続部の界面における絶縁破壊特性
固体絶縁物接続部の界面における絶縁破壊特性 : 樹脂の種類と面圧の影響
コタイゼツエンブツセツゾクブノカイメンニオケルゼツエンハカイトクセイ : ジュシノシュルイトメンアツノエイキョウ
－樹脂の種類と面圧の影響－

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<p>One of the weak points of all solid insulation system is the breakdown strength along the interface between two solid dielectrics. The low breakdown voltage is considered to be due to the small cavities formed in the interface due to surface morphology. In this paper, we investigated the effects of dielectric material and compressive force on interfacial breakdown voltages. The results that we obtained are as follows: (1) most of the interfacial breakdowns between two solid dielectrics were developed by avoiding the contact area for high-pressure region, (2) in cases of polymethyl methacrylate (PMMA) and high-density polyethylene (HDPE), the breakdown voltages increased with increasing the compressive force, (3) mechanically soft insulating material was found to be better than hard material, because cavities existed between two solid dielectrics by compressive force become small, and (4) although the same compressive force was applied to the interface, the breakdown voltages increased with increasing uniformity of the surface.</p>

Journal

IEEJ Transactions on Fundamentals and Materials

IEEJ Transactions on Fundamentals and Materials 139 (3), 147-153, 2019-03-01

The Institute of Electrical Engineers of Japan

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