マイクロバンプ用めっき金薄膜の微細組織と強度・信頼性

DOI Web Site
  • 名越 優太郎
    東北大学 大学院工学研究科 ファインメカニクス専攻
  • 鈴木 研
    東北大学 工学研究科付属先端材料強度科学研究センター
  • 三浦 英生
    東北大学 工学研究科付属先端材料強度科学研究センター

書誌事項

タイトル別名
  • Microstructures and strength and reliability of electroplated gold thin film for micro bump

抄録

<p>Electroplated gold thin films have been used for micro bumps in flip chip packing structures. However, it has been reported that physical properties and micro texture of the electroplated gold thin films fluctuate drastically depending on their manufacturing process. In particular, it was found that the long-time reliability of micro bumps and interconnections is degraded drastically by porous grain boundaries due to a lot of defects because of the acceleration of atomic diffusion along the porous grain boundaries under the application of high current density (electromigration) and high mechanical stress (stress-induced migration). In this study, in order to evaluate the effect of atomic arrangement of under layer on the crystallinity of electroplated gold thin films, under layer material used for electroplating was changed; such as Cr (30 nm) /Pt (50 nm) /Au (200 nm) and Ti (30 nm) /Au (100 nm). The micro texture of the films such as crystallinity and crystallographic orientation was analyzed by EBSD (Electron Back-Scatter Diffraction) and XRD (X-Ray Diffraction). It was found that the crystallinity of both grain and grain boundaries of the electroplated gold varied depending on the quality of atomic arrangement of under layer and heat treatment. Therefore, it is significantly important to control of the crystallinity of under layer in order to control of physical properties and reliability of the electroplated gold thin films.</p>

収録刊行物

  • 年次大会

    年次大会 2018 (0), J0610204-, 2018

    一般社団法人 日本機械学会

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