鉛フリーはんだ接合に対応した硫酸浴からのSn-Ag-Cu合金めっき

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タイトル別名
  • Sn-Ag-Cu Alloy Electroplating from Acid Sulfate Baths for Pb-free Solder
  • ナマリ フリー ハンダ セツゴウ ニ タイオウ シタ リュウサンヨク カラ ノ Sn Ag Cu ゴウキンメッキ

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<p>The purpose of this investigation was to study Sn-Ag-Cu alloy electroplating for Pb-free solder from acid sulfate baths (2M H2SO4+0.1 M SnSO4+0.0025 M Ag2SO4+0.002 M CuSO4+0.2 M thiourea) containing N,N-bis(polyoxyethylene)octadecylamine[C18H37N[(CH2CH2O)10H]2:POOA-10] by means of various electrochemical methods, scanning electron microscopic observation, X-ray diffractometry and differential scanning calorimetry. Dendritic electrodeposits were obtained from acid sulfate bath in the absence of organic additives. On the other hand, granular crystals were observed on the whole surface by adding POOA-10. Sn-Ag-Cu alloy electrodeposits containing 3.5~4.2 at% Ag and 1.1~1.8 at% Cu were obtained from acid sulfate baths containing 1 mM POOA- 10 under galvanostatic conditions (1.0~ 5.0 A/dm2). Sn-Ag-Cu alloy electrodeposits obtained from acid sulfate baths containing 1 mM POOA- 10 consist of β-Sn phase, ε(Ag3Sn) phase and η(Cu6Sn5) phase. The solidus temperature of electrodeposit is 217°C and this temperature coincides with the eutectic temperature of casted Sn-3.8 at% Ag-1.4 at%Cu eutectic Alloy.</p>

収録刊行物

  • Electrochemistry

    Electrochemistry 73 (11), 951-955, 2005-11-05

    公益社団法人　電気化学会

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