難加工基板材料向け高速高圧研磨プロセスの評価

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  • Evaluation of High-Speed and High-Pressure Polishing Process for Hard-to-Process Materials

抄録

<p>Silicon carbide (SiC) and Gallium nitride (GaN), which are expected as next-generation power semiconductor materials, are hard-to-process materials. We have developed a high-speed and high-pressure polishing machine (SLM-140H) for aiming at hard-to-process materials. Using this machine, a high polishing rate was obtained compared to conventional conditions. This machine has a function to measure and record various parameters during polishing, such as a load cells and pad surface thermometer. In this paper, we analyzed and evaluated parameters such as load cells value and pad surface temperature , and clarified the polishing state under high-speed and high-pressure conditions.</p>

収録刊行物

  • 年次大会

    年次大会 2020 (0), S16309-, 2020

    一般社団法人 日本機械学会

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