Photocatalytic Amino-Group Modification of Diamond and High Dispersion Composite Technique with Copper Substrate

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  • KATO Kazuki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science
  • ISHIDA Naoya
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Research Institute for Science and Technology, Tokyo University of Science
  • SUZUKI Norihiro
    Research Institute for Science and Technology, Tokyo University of Science
  • FUJIMOTO Kenjiro
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Research Institute for Science and Technology, Tokyo University of Science
  • HAGIO Takeshi
    Institute of Materials Innovation, Institutes of Innovation for Future Society, Nagoya University
  • ICHINO Ryoichi
    Institute of Materials Innovation, Institutes of Innovation for Future Society, Nagoya University
  • KONDO Takeshi
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Research Institute for Science and Technology, Tokyo University of Science
  • YUASA Makoto
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Research Institute for Science and Technology, Tokyo University of Science
  • UETSUKA Hiroshi
    Research Institute for Science and Technology, Tokyo University of Science Asahi Diamond Industrial Co. Ltd.
  • FUJISHIMA Akira
    Research Institute for Science and Technology, Tokyo University of Science
  • TERASHIMA Chiaki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science Research Institute for Science and Technology, Tokyo University of Science

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Other Title
  • 光触媒を用いたダイヤモンドのアミノ基修飾と銅基質に対する高分散複合化技術
  • ヒカリ ショクバイ オ モチイタ ダイヤモンド ノ アミノキ シュウショク ト ドウキシツ ニ タイスル コウブンサン フクゴウカ ギジュツ

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Abstract

<p>We strove to produce a microdiamond（MD）- copper composite by electroplating. Unfortunately, copper is naturally non-wetting with MD because of their chemical incompatibility. We achieved modification of the amino group for the MD surface using a photocatalytic treatment, followed by electroplating of the copper. Results demonstrated that the MD - copper composite material assisted by photocatalysis markedly improved their interfacial affinity and thermal conductivity.</p>

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