Pre-treatment with Stealth Type Laser Dicing for TEM Sample Preparation

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  • 内部集光型レーザダイシングを用いたTEM試料作製の前処理手法
  • ナイブ シュウコウガタ レーザダイシング オ モチイタ TEM シリョウ サクセイ ノ マエショリ シュホウ

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Description

<p>In the process of preparing TEM samples, many cutting/polishing operations are required as pretreatment. Here, we attempted to replace the typical pretreatment of cutting dices with a cutting wheel and polishing to a thickness of 100 μm with stealth dicing. This processing is particularly suitable for semiconductor wafers, and has many advantages such as time saving, high accuracy, automation, resource saving, dryness, and non-contact.</p>

Journal

  • KENBIKYO

    KENBIKYO 56 (3), 139-142, 2021-12-30

    The Japanese Society of Microscopy

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