High Heat Resistance and High Thermal Conduction Resin Composite Material

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  • 高耐熱・高熱伝導樹脂複合材料
  • コウタイネツ　コウネツデンドウ　ジュシ　フクゴウ　ザイリョウ

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Abstract

In the power module products, insulated materials are asked for high heat dissipation along with achievement of downsizing and high efficiency of the electronic equipment. In order to give high thermal conductivity to the thermosetting resin like the epoxy resin, composite with high heat conduction ceramic, such as boron nitride (BN), is investigated. The orientation control of BN particle by blending the aggregated BN filler realized the high thermal conductivity more than I 8W/(m・K). In addition, the adhesion strength with copper was greatly improved while maintaining the high heat resistance by adding flexible resin in high heat-resistant cyanate ester resin. By a combination in these techniques, the high heat resistance and high thermal conduction resin composite material was developed.

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