Microjoining Process in Electronic Packaging and Its Numerical Analysis

DOI HANDLE Open Access

Search this article

Journal

  • Transactions of JWRI

    Transactions of JWRI 30 (1), 1-11, 2001-07

    Joining and Welding Research Institute, Osaka University

Details 詳細情報について

  • CRID
    1390012777802201600
  • NII Article ID
    110006486096
  • NII Book ID
    AA00867058
  • DOI
    10.18910/6000
  • HANDLE
    11094/6000
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • JaLC
    • IRDB
    • CiNii Articles

Report a problem

Back to top